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'Sub-Hertz' Dielectric Spectroscopy

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conference contribution
posted on 2008-11-04, 15:17 authored by John C. Fothergill, K.B.A. See, Mohammed Nasser Ajour, Len A. Dissado
Dielectric spectroscopy measurements below 1 Hz are often dominated by “conduction-like” effects. For this reason, they often appear to be dismissed as being of little interest. In this paper two “sub-hertz” responses are considered that give insights into the insulating sys-tems concerned. The first system is that of cross-linked polyethylene, taken from a power cable system. Measurements at temperatures between 60°C and close to melting at 100°C show a change in characteristic from a percolation process to a “true” DC conduction at close to the melting point. Using DC conductivities, it appears to be possible to show whether the cable has been subjected to thermo-electric ageing. This might give insights into where the conduction and hence the ageing in the XLPE is occurring. The second system is an epoxy composite. By considering the sub-hertz response, it is possible to demonstrate the effect of the interface between the filler and the epoxy matrix. In this system, ageing, resulting in delamination between the glass fiber filler and the epoxy, is clearly detected by sub-hertz dielectric spectroscopy. This process is likely to be facilitated by the presence of water, which is known to lead to mechanical failure in such systems, and which can also be detected by "sub-hertz" dielectric spectroscopy. The implications for nano-dielectrics are then briefly considered.

History

Citation

Electrical Insulating Materials, 2005, 3, pp. 821-824.

Published in

Electrical Insulating Materials

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

isbn

488686063X

Available date

2008-11-04

Notes

This is the author's final draft of the paper published as Electrical Insulating Materials, 2005, 3, pp. 821-824 and presented at the 2005 International Symposium on Electrical Insulating Materials, June 5-9 2005 in Kitakyushu, Japan. Copyright © 2005 IEEE. The final version is available from http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1496310. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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en

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