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Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints

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journal contribution
posted on 2010-12-01, 15:42 authored by S. Belyakov, Helen V. Atkinson, S. P. A. Gill
Crystallographically faceted void (CFV) formation in lead-free solder joints has been observed after solidification and during subsequent solid-state aging. Such voids have not previously been reported in the literature. This paper gives a preliminary report on observations of voids which tend to be associated with, and adjacent to, intermetallic compounds in the solder bulk and near-substrate interface region. It has been observed that CFVs are correlated with β-Sn crystallographic orientation and form in a tetragonal shape. Aging promotes CFV clustering and growth.

History

Citation

Journal of Electronic Materials, 2010, 39 (8), pp. 1295-1297

Published in

Journal of Electronic Materials

Publisher

Springer Verlag

issn

0361-5235

Available date

2010-12-01

Publisher version

http://link.springer.com/article/10.1007/s11664-010-1184-6

Notes

This is the author’s final draft of the paper published as Journal of Electronic Materials, 2010, 39 (8), pp. 1295-1297. The original publication is available at www.springerlink.com, Doi: 10.1007/s11664-010-1184-6.

Language

en

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