Differential Scanning Calorimetry (DSC) and Thermodynamic Prediction of Liquid Fraction vs Temperature for Two High-Performance Alloys for Semi-Solid Processing (Al-Si-Cu-Mg (319s) and Al-Cu-Ag (201))
journal contributionposted on 2017-09-19, 16:10 authored by Duyao Zhang, Helen V. Atkinson, Hongbiao Dong, Qiang Zhu
There is a need to extend the application of semi-solid processing (SSP) to higher performance alloys such as 319s (Al-Si-Cu-Mg) and 201 (Al-Cu-Ag). The melting of these two alloys was investigated using differential scanning calorimetry (DSC) and thermodynamic prediction. The alloys had been processed by magneto-hydrodynamic (MHD) stirring before receipt to produce a microstructure suitable for SSP. The DSC results for the as-received MHD material were compared with those for material which has been taken through a complete DSC cycle and then reheated for a second DSC run. The effects of microsegregation were then analyzed. A higher liquid fraction for a particular temperature is found in the second DSC run than the first. Microstructural observations suggest this is because the intermetallics which form during the first cooling cycle tend to co-located. Quaternary and ternary reactions then occur during the second DSC heat and the co-location leads to enhanced peaks. The calculated liquid fraction is lower with 10 K/min DSC heating rate comparing with 3 K/min at a given temperature. The DSC scan rate must therefore be carefully considered if it is to be used to identify temperature parameters or the suitability of alloys for SSP. In addition, the starting material for DSC must represent the starting material for the SSP. With thermodynamic prediction, the equilibrium condition will provide better guidance for the thixoforming of MHD stirred starting material than the Scheil condition. The Scheil mode approximates more closely with a strongly microsegregated state.
CitationMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 2017, pp. 1-12
Author affiliation/Organisation/COLLEGE OF SCIENCE AND ENGINEERING/Department of Engineering
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