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Impact of dynamic voltage scaling and thermal factors on SRAM reliability

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journal contribution
posted on 2016-04-26, 14:20 authored by F. R. Rosa, R. M. Brum, G. Wirth, F. Kastensmidt, Luciano Ost, R. Reis
This work investigates the effects of temperature and voltage scaling in neutron-induced bit-flip in SRAM memory cells. Proposed approach allows determining the critical charge according to the dynamic behavior of the temperature as a function of the voltage scaling. Experimental results show that both temperature and voltage scaling can increase in at least two times the susceptibility of SRAM cells to soft error rate (SER). In addition, a model for electrical simulation for soft error and different voltages was described to investigate the effects observed in the practical neutron irradiation experiments. Results can guide designers to predict soft error effects during the lifetime of SRAM-based devices considering different power supply modes.

History

Citation

Microelectronics Reliability, 2015, 55 (9-10), pp. 1486–1490, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

Author affiliation

/Organisation/COLLEGE OF SCIENCE AND ENGINEERING/Department of Engineering

Source

26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Toulouse, France.

Version

  • AM (Accepted Manuscript)

Published in

Microelectronics Reliability

Publisher

Elsevier

issn

0026-2714

Acceptance date

2015-07-03

Copyright date

2015

Available date

2016-04-26

Publisher version

http://www.sciencedirect.com/science/article/pii/S0026271415301001

Temporal coverage: start date

2015-10-05

Temporal coverage: end date

2015-10-09

Language

en

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