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Perspectives for Deep Eutectic Solvents and Ionic Liquid Analogues in Metal Electroplating

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posted on 2024-06-12, 10:18 authored by Karl Scott Ryder, Chunhong Lei, Anthony J Lucio, Stephen Viles

Here we will specifically describe the opportunities and perspectives offered by non-aqueous so-called deep eutectic solvents (DES) and ionic liquid analogues (ILA) in the materials finishing and metal electroplating industries. We will describe a range of plating and dissolution processes from anti-corrosion coatings to new battery technologies. Details will be presented of the plating and characterisation techniques using some novel in-situ methods. These include electrochemical processing and characterisation as well as a number of cutting-edge surface methodologies including acoustic resonance methods, ESR, EXAFS, atomic force microscopy, neutron scattering techniques and magnetic resonance imaging. We will describe a number of case-studies including electrolytic deposition of nickel, alloys such as Ni/Zn, and galvanic methods associated with Au and Ag coatings for the electronics industry. 1, 2, 3 In all these studies we have focused on a combination of fundamental chemical, electrochemical, structural and spectroscopic studies, maintaining close links with industrial partners through collaboration and scale-up trials. We will include very recent updates and future prospects on the use of ILA's in energy storage vectors such as Al secondary batteries. We will describe the advantages and drawbacks of DES and ILA systems in terms of functionality, sustainability and economic cost.

History

Author affiliation

College of Science & Engineering Chemistry

Source

242nd ECS Meeting October 9, 2022 - October 13, 2022 Atlanta, USA

Version

  • AM (Accepted Manuscript)

Published in

ECS Meeting Abstracts

Volume

MA2022-02

Issue

24

Pagination

1010 - 1010

Publisher

The Electrochemical Society

eissn

2151-2043

Copyright date

2022

Available date

2024-06-12

Language

English

Deposited by

Professor Karl Ryder

Deposit date

2024-06-11

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