posted on 2012-10-24, 09:06authored byDJ Barnhart, T Vladimirova, MN Sweeting
THERE is a growing trend toward distributed missions for scientific and remote sensing applications where large
numbers of satellites are required. Analogous to proliferating terrestrial wireless sensor networks, space sensor
networks could provide an unprecedented capability to investigate widespread phenomena. For example, several
important space weather missions have yet to be realized due to the present inability to take simultaneous
measurements of a phenomenon over a large volume. Space economics and environmental concerns dictate a costeffective mass-producible low-mass satellite for such massively distributed missions in low Earth orbit (LEO).
An investigation of very small (sub-kilogram) satellite miniaturization techniques has been undertaken, focusing
on enabling technologies targeted at space sensor network applications. Existing and emerging very small satellite
technologies have been assessed and compared with power generation and payload volume being the key
performance metrics. Two novel design methodologies have been developed, simulated, and verified through
functional and environmental testing of hardware prototypes. SpaceChip, inspired by the satellite-on-a-chip vision,
is a monolithic heterogeneous system-on-a-chip (SoC) integration approach.
1,2 PCBSat is a proposed miniaturization
approach, which is based on printed circuit board (PCB) substrates.
3
PCBSat is focused on deriving the smallest
practical satellite within the context of space sensor networks, and constrained to the use of commercial off the shelf
(COTS) components, processes, and deployment systems.
Funding
This effort was graciously sponsored by the U.S. Air Force Office of Scientific Research, U.S. Air Force Research Laboratory, Colorado Satellite Services, British Interplanetary Society, and Surrey Satellite Technology Limited.
History
Citation
JOURNAL OF SPACECRAFT AND ROCKETS, 2009, 46 (2), pp. 469-472 (4)
Author affiliation
/Organisation/COLLEGE OF SCIENCE AND ENGINEERING/Department of Engineering
Version
AM (Accepted Manuscript)
Published in
Journal of Spacecraft and Rockets
Volume
46
Issue
2
Pagination
pp. 469-472 (4)
Publisher
American Institute of Aeronautics and Astronautics